Patent Assignment
Reel/Frame 058113/0256
Assignment of Assignor's Interest
Recorded: 2021-11-15
Pages: 4
Assignors
HWANG, HYEONJEONG
Executed: 2021-10-01
SUK, KYOUNGLIM
Executed: 2021-10-01
LEE, SEOKHYUN
Executed: 2021-10-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Under Bump Metallization Pad