Semiconductor package including under bump metallization pad
A semiconductor package includes a semiconductor chip, a lower redistribution layer disposed under the semiconductor chip, the lower redistribution layer including a plurality of lower insulating layers, a plurality of lower redistribution patterns, and a plurality of lower conductive vias, a lower passivation layer disposed under the lower redistribution layer and provided with a recess at a bottom surface of the lower passivation layer, an under bump metallization (UBM) pad disposed in the first recess, a UBM protective layer disposed in the first recess and connected to the lower conductive vias while covering a top surface and opposite side surfaces of the UBM pad, and an outer connecting terminal connected to a bottom surface of the UBM pad. The bottom surface of the UBM pad is positioned at a first depth from the bottom surface of the lower passivation layer.
1. A semiconductor package comprising:
a semiconductor chip;
a lower redistribution layer disposed under the semiconductor chip, the lower redistribution layer comprising a plurality of lower insulating layers, a plurality of lower redistribution patterns, and a plurality of lower conductive vias;
a lower passivation layer disposed under the lower redistribution layer and provided with a first recess at a bottom surface of the lower passivation layer;
an under bump metallization (UBM) pad disposed in the first recess;
a UBM protective layer disposed in the first recess and covering a top surface and side surfaces of the UBM pad; and
an outer connecting terminal connected to a bottom surface of the UBM pad,
wherein the bottom surface of the UBM pad is positioned at a first depth from the bottom surface of the lower passivation layer.
2. The semiconductor package according to claim 1 ,
wherein the bottom surface of the lower passivation layer is coplanar with a bottom surface of the UBM protective layer.
3. The semiconductor package according to claim 1 ,
wherein a cross-section of the UBM pad has a rectangular shape.
4. The semiconductor package according to claim 1 , further comprising;
a second recess defined by an inner side surface of the UBM protective layer and the bottom surface of the UBM pad.
5. The semiconductor package according to claim 1 ,
wherein the first depth is between 400 nm and 600 nm.
6. The semiconductor package according to claim 1 ,
wherein the UBM protective layer comprises Ti.
7. The semiconductor package according to claim 1 , wherein a thickness of the UBM protective layer is 3 nm or less.
8. The semiconductor package according to claim 1 , further comprising:
a lower barrier layer covering side surfaces of the plurality of lower redistribution patterns, and side surfaces and bottom surfaces of the plurality of lower conductive vias.
9. The semiconductor package according to claim 1 , further comprising:
a molding layer disposed on the lower passivation layer and surrounding the semiconductor chip.
10. The semiconductor package according to claim 9 , further comprising:
an upper redistribution layer disposed on the molding layer,
wherein the upper redistribution layer comprises:
a plurality of upper insulating layers;
a plurality of upper redistribution patterns buried in the plurality of upper insulating layers, respectively; and
an upper conductive via interconnecting the plurality of upper redistribution patterns with each other.
11. The semiconductor package according to claim 10 , further comprising:
a connecting via interconnecting the lower redistribution layer and the upper redistribution layer with each other.
12. A semiconductor package comprising:
a semiconductor chip;
a lower redistribution layer disposed under the semiconductor chip, the lower redistribution layer comprising:
a plurality of lower insulating layers,
a plurality of lower redistribution patterns disposed at the plurality of lower insulating layers, respectively, and
a plurality of lower conductive vias interconnecting the plurality of lower redistribution patterns with each other;
a lower barrier layer covering side surfaces of the plurality of lower redistribution patterns and side surfaces and bottom surfaces of the plurality of lower conductive vias;
an underfill disposed between the semiconductor chip and the lower redistribution layer;
a lower passivation layer disposed under the lower redistribution layer and provided with a first recess at a bottom surface of the lower passivation layer;
an under bump metallization (UBM) pad disposed in the first recess;
a UBM protective layer disposed in the first recess and connected to the lower barrier layer, wherein the UBM protective layer covers a top surface and side surfaces of the UBM pad;
a molding layer disposed on the lower redistribution layer and covering the semiconductor chip;
an upper redistribution layer disposed on the molding layer, the upper redistribution layer comprising:
a plurality of upper insulating layers, a plurality of upper redistribution patterns disposed at the plurality of upper insulating layers, respectively, and
a plurality of upper conductive vias interconnecting the plurality of upper redistribution patterns;
an upper barrier layer covering side surfaces of the plurality of upper redistribution patterns and side surfaces and bottom surfaces of the plurality of upper conductive vias; and
a connecting via interconnecting the lower redistribution layer and the upper redistribution layer with each other,
wherein a bottom surface of the UBM pad is positioned at a first depth from the bottom surface of the lower passivation layer, and
wherein the bottom surface of the lower passivation layer is coplanar with a bottom surface of the UBM protective layer.
13. The semiconductor package according to claim 12 , wherein:
a thickness of the UBM protective layer is 3 nm or less; and
the first depth is between 400 nm and 600 nm.