Patent Assignment
Reel/Frame 058121/0152
Assignment of Assignor's Interest
Recorded: 2021-11-16
Pages: 3
Assignors
SINGH, GULBAGH
Executed: 2018-03-08
CHUANG, KUN-TSANG
Executed: 2018-03-08
CHEN, HSIN-CHI
Executed: 2018-03-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming a Bulk Semiconductor Substrate Configured to Exhibit SOI Behavior