Patent Assignment
Reel/Frame 058146/0992
Assignment of Assignor's Interest
Recorded: 2021-11-18
Pages: 7
Assignors
LEE, SEUGMIN
Executed: 2021-10-29
KANG, KIYOON
Executed: 2021-10-29
KIM, KANGMIN
Executed: 2021-10-29
KIM, DONGSEONG
Executed: 2021-10-29
KIM, JUNHYOUNG
Executed: 2021-10-29
YOU, BYUNGKWAN
Executed: 2021-10-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Support Structure, Method for Manufacturing the Same and Electronic System Including the Same