Patent Assignment
Reel/Frame 058168/0128
Assignment of Assignor's Interest
Recorded: 2021-11-19
Pages: 5
Assignors
LEE, KAI-HSUAN
Executed: 2021-11-09
LIN, SHIH-CHE
Executed: 2021-11-09
HUANG, PO-YU
Executed: 2021-11-09
WU, SHIH-CHIEH
Executed: 2021-11-09
WU, I-WEN
Executed: 2021-11-09
LEE, CHEN-MING
Executed: 2021-11-09
YANG, FU-KAI
Executed: 2021-11-12
WANG, MEI-YUN
Executed: 2021-11-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Method for Forming the Same