Patent Assignment
Reel/Frame 058180/0286
Assignment of Assignor's Interest
Recorded: 2021-11-22
Pages: 6
Assignors
SHIN, SEUNG HUN
Executed: 2021-11-15
KANG, UN BYOUNG
Executed: 2021-11-15
KO, YEONG KWON
Executed: 2021-11-15
LEE, JONG HO
Executed: 2021-11-15
LEE, TEAK HOON
Executed: 2021-11-15
HEO, JUN YEONG
Executed: 2021-11-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package