IP Library › Assignment 058181/0750
Patent Assignment
Reel/Frame 058181/0750

Assignment of Assignor's Interest

Recorded: 2021-11-22 Pages: 6
Assignors
ZHAO, NAN
Executed: 2020-09-28
XIE, WENXU
Executed: 2020-09-28
TAO, JUNLEI
Executed: 2021-11-19
CHIANG, SHANGSUAN
Executed: 2020-09-28
FU, HUILI
Executed: 2021-11-19
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, 518129, CHINA
Covered Property (1)
Encapsulation of a Substrate Electrically Connected to a Plurality of Pin Arrays
Application: 16/997,003 →
Publication: US 2020/0381361
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the 4TH Assignor's First Name Previously Recorded at Reel: 058161 Frame: 0750. Assignor(S) Hereby Confirms the Assignment . Jan 19, 2022
From: ZHAO, NAN; XIE, WENXU; TAO, JUNLEI; CHIANG, SHANGHSUAN
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 058771/0394 →