IP Library › Assignment 058771/0394
Patent Assignment
Reel/Frame 058771/0394

Corrective Assignment to Correct the 4TH Assignor's First Name Previously Recorded at Reel: 058161 Frame: 0750. Assignor(S) Hereby Confirms the Assignment .

Recorded: 2022-01-19 Pages: 12
Assignors
ZHAO, NAN
Executed: 2020-09-28
XIE, WENXU
Executed: 2020-09-28
TAO, JUNLEI
Executed: 2021-11-19
CHIANG, SHANGHSUAN
Executed: 2020-09-28
FU, HUILI
Executed: 2021-11-19
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, 518129, CHINA
Covered Property (1)
Encapsulation of a Substrate Electrically Connected to a Plurality of Pin Arrays
Application: 16/997,003 →
Publication: US 2020/0381361
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 22, 2021
From: ZHAO, NAN; XIE, WENXU; TAO, JUNLEI; CHIANG, SHANGSUAN
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 058181/0750 →