IP Library Assignment 058185/0115
Patent Assignment
Reel/Frame 058185/0115

Assignment of Assignor's Interest

Recorded: 2021-11-22 Pages: 10
Assignors
KONDO, SHUNSUKE
Executed: 2021-06-14
OTSUKA, YUYA
Executed: 2021-11-16
KOMINE, MAYUMI
Executed: 2021-10-11
INOUE, KEISUKE
Executed: 2021-09-23
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Polishing Liquid and Polishing Method
Application: 17/251,531 →
Publication: US 2021/0253906
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →