Patent Assignment
Reel/Frame 058193/0073
Assignment of Assignor's Interest
Recorded: 2021-11-23
Pages: 8
Assignors
CHUANG, HARRY-HAK-LAY
Executed: 2019-06-28
WANG, HUNG CHO
Executed: 2019-06-19
TSAI, JIUNYU
Executed: 2019-06-05
HUANG, SHENG-HUANG
Executed: 2019-06-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Techniques for Mram Mtj Top Electrode to via Interface