Patent Assignment
Reel/Frame 058201/0144
Assignment of Assignor's Interest
Recorded: 2021-11-23
Pages: 5
Assignors
HSU, CHUNG-WEI
Executed: 2021-06-21
CHIANG, KUO-CHENG
Executed: 2021-06-21
HUANG, MAO-LIN
Executed: 2021-06-21
CHU, LUNG-KUN
Executed: 2021-06-21
YU, JIA-NI
Executed: 2021-06-21
CHENG, KUAN-LUN
Executed: 2021-06-21
WANG, CHIH-HAO
Executed: 2021-06-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Nanosheet Device Architecture for Cell-Height Scaling