Patent Assignment
Reel/Frame 058209/0976
Security Interest
Recorded: 2021-11-24
Pages: 7
Assignor
HI-TECH MOLD & ENGINEERING, INC.
Executed: 2021-07-12
Assignee
CIBC BANK USA
120 S. LASALLE STREET, CHICAGO, ILLINOIS, 60603
Covered Property
(1)
Die Insert for Molding a Speaker Grille
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 17, 2017
From: KILLORAN, STEVE; DEBENEDICTIS, ANTHONY; GESCHKE, DAVID; TAVERNER, KEVIN
To: HI-TECH MOLD & ENGINEERING, INC.
Reel/Frame 042269/0387 →
Security Interest
Nov 1, 2019
From: HI-TECH MOLD & ENGINEERING, INC.
To: COMERICA BANK, AS AGENT
Reel/Frame 050890/0170 →
Release of Security Interest
Jul 23, 2021
From: COMERICA BANK, AS AGENT
To: HI-TECH MOLD & ENGINEERING, INC.
Reel/Frame 056964/0878 →