Patent Assignment
Reel/Frame 058219/0967
Assignment of Assignor's Interest
Recorded: 2021-10-22
Pages: 6
Assignors
OHNO, ISAO
Executed: 2021-07-12
DAIZO, TOMOYA
Executed: 2021-08-06
SAWADA, YOJI
Executed: 2021-08-06
KURANOBU, KAZUHIKO
Executed: 2021-08-12
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Substrate