Patent Assignment
Reel/Frame 058238/0194
Assignment of Assignor's Interest
Recorded: 2021-11-30
Pages: 4
Assignors
LEE, DOOHWAN
Executed: 2021-09-07
CHOI, WONKYOUNG
Executed: 2021-09-07
LEE, JEONGHO
Executed: 2021-09-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Through-Electrode Penetrating a Molding Part