Patent Assignment
Reel/Frame 058239/0601
Assignment of Assignor's Interest
Recorded: 2021-11-30
Pages: 6
Assignors
KIM, DONGHWAN
Executed: 2021-07-12
KANG, SHINHWAN
Executed: 2021-07-12
NOH, YOUNGJI
Executed: 2021-07-12
PARK, JUNG-HWAN
Executed: 2021-07-12
CHUN, SANGHUN
Executed: 2021-07-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Devices, Methods of Fabricating the Same, and Electronic Systems Including the Same