Patent Assignment
Reel/Frame 058242/0827
Assignment of Assignor's Interest
Recorded: 2021-11-30
Pages: 4
Assignors
YANG, TZU-HSIEN
Executed: 2021-07-06
NOGUCHI, HIROKI
Executed: 2021-07-06
FUJIWARA, HIDEHIRO
Executed: 2021-07-09
WANG, YIH
Executed: 2021-07-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Vertical Interconnect Structures in Three-Dimensional Integrated Circuits