Patent Assignment
Reel/Frame 058259/0124
Assignment of Assignor's Interest
Recorded: 2021-12-01
Pages: 7
Assignors
LEE, HYEONCHUL
Executed: 2021-11-25
LEE, HUNTEAK
Executed: 2021-11-25
TAK, HYUNSU
Executed: 2021-11-25
LEE, WANIL
Executed: 2021-11-25
SEO, INHO
Executed: 2021-11-25
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Manufacturing Equipment and Method of Providing Support Base with Filling Material Disposed into Openings in Semiconductor Wafer for Support
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.