Patent Assignment
Reel/Frame 058260/0105
Assignment of Assignor's Interest
Recorded: 2021-12-01
Pages: 6
Assignors
HWANG, HYEONJEONG
Executed: 2021-10-18
SUK, KYOUNG LIM
Executed: 2021-10-18
LEE, SEOKHYUN
Executed: 2021-10-18
JANG, JAEGWON
Executed: 2021-10-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package