Patent Assignment
Reel/Frame 058276/0944
Assignment of Assignor's Interest
Recorded: 2021-12-03
Pages: 2
Assignor
HYUNG, YONG WOO
Executed: 2021-11-30
Assignee
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO. 88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU, FUIJAN, 362200, CHINA
Covered Property
(1)
Semiconductor Device Having an Air Gap Between a Contact Pad and a Sidewall of Contact Hole