Patent Assignment
Reel/Frame 058295/0506
Assignment of Assignor's Interest
Recorded: 2021-12-02
Pages: 5
Assignors
KUAH, TENG HOCK
Executed: 2021-11-29
LIN, YI
Executed: 2021-11-29
RAGHAVENDRA, RAVINDRA
Executed: 2021-11-29
YAN, KAR WENG
Executed: 2021-11-29
PEREZ, ANGELITO BARROZO
Executed: 2021-11-29
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Encapsulation Process for Double-Sided Cooled Packages
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.