Patent Assignment
Reel/Frame 058305/0424
Assignment of Assignor's Interest
Recorded: 2021-12-06
Pages: 6
Assignors
CHOI, HEEJUNG
Executed: 2021-10-19
LEE, HEESEOK
Executed: 2021-10-19
PAK, JUNSO
Executed: 2021-10-19
YU, BONGWEE
Executed: 2021-10-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Dualized Signal Wiring Structure