Patent Assignment
Reel/Frame 058305/0750
Assignment of Assignor's Interest
Recorded: 2021-12-06
Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2021-12-02
CHIOU, WEN-CHIH
Executed: 2021-08-29
YANG, KU-FENG
Executed: 2021-08-30
CHUNG, MING-TSU
Executed: 2021-08-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Heterogeneous Dielectric Bonding Scheme