Patent Assignment
Reel/Frame 058309/0334
Assignment of Assignor's Interest
Recorded: 2021-12-06
Pages: 4
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, GYEONGGI-DO, ICHEON-SI, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device with Interlayer Insulation Structure Including Metal-Organic Framework Layer and Method of Manufacturing the Same