Patent Assignment
Reel/Frame 058319/0971
Assignment of Assignor's Interest
Recorded: 2021-12-07
Pages: 6
Assignors
HONG, WONHYUK
Executed: 2021-08-16
LEE, EUI BOK
Executed: 2021-08-16
KIM, RAKHWAN
Executed: 2021-08-19
JANG, WOOJIN
Executed: 2021-08-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including via Structures Having a via Portion and a Barrier Portion