Patent Assignment
Reel/Frame 058320/0976
Assignment of Assignor's Interest
Recorded: 2021-12-07
Pages: 6
Assignors
KIM, TAEYEONG
Executed: 2021-11-25
KIM, TAESEONG
Executed: 2021-11-25
MOON, KWANGJIN
Executed: 2021-11-25
JEON, HYUNGJUN
Executed: 2021-11-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Bonding Enhancement Layer and Method of Forming the Same