Patent Assignment
Reel/Frame 058330/0239
Assignment of Assignor's Interest
Recorded: 2021-12-08
Pages: 5
Assignors
LEE, JEONGHYUN
Executed: 2021-11-04
PARK, HWANPIL
Executed: 2021-11-08
SHIM, JONGBO
Executed: 2021-11-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package