Patent Assignment
Reel/Frame 058340/0459
Assignment of Assignor's Interest
Recorded: 2021-12-08
Pages: 3
Assignor
EID, FERAS
Executed: 2017-10-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Warpage Mitigation Structures Created on Substrate Using High Throughput Additive Manufacturing