Patent Assignment
Reel/Frame 058343/0883
Assignment of Assignor's Interest
Recorded: 2021-12-09
Pages: 5
Assignors
KUO, CHE-HUNG
Executed: 2021-11-29
LIU, HSING-CHIH
Executed: 2021-11-29
CHEN, TAI-YU
Executed: 2021-12-08
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Structure