Patent Assignment
Reel/Frame 058385/0617
Assignment of Assignor's Interest
Recorded: 2021-12-14
Pages: 6
Assignors
KWON, HEUNGKYU
Executed: 2021-11-27
PAK, JUNSO
Executed: 2021-11-29
LEE, HEESEOK
Executed: 2021-12-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Dual Stiffener