Patent Assignment
Reel/Frame 058390/0548
Assignment of Assignor's Interest
Recorded: 2021-12-14
Pages: 5
Assignors
HWANG, DONG WEON
Executed: 2021-12-10
HWANG, LOGAN JAE
Executed: 2021-12-10
HWANG, JAE BAEK
Executed: 2021-12-10
Assignees
HICON CO., LTD.
9F., 37, SAGIMAKGOL-RO 62BEON-GIL, JUNGWON-GU, GYEONGGIDO, SEONGNAM-SI, 13211, KOREA, REPUBLIC OF
HWANG, DONG WEON
85, DUMIL-RO 123BEON-GIL, BUNDANG-GU, GYEONGGI-DO, SEONGNAM-SI, 13544, KOREA, REPUBLIC OF
HWANG, LOGAN JAE
9988 LIEBE DR., BEVERLY HILLS, CALIFORNIA, 90210
HWANG, JAE BAEK
#74-503, 201, APGUJEONG-RO, GANGNAM-GU, SEOUL, 06004, KOREA, REPUBLIC OF
Covered Property
(1)
Contact and Socket Device for Burning-in and Testing Semiconductor Ic