Patent Assignment
Reel/Frame 058409/0009
Assignment of Assignor's Interest
Recorded: 2021-12-16
Pages: 9
Assignors
TOMITA, YOSHIHIRO
Executed: 2021-09-22
ALEKSOV, ALEKSANDAR
Executed: 2021-10-12
EID, FERAS
Executed: 2021-09-21
ELSHERBINI, ADEL
Executed: 2021-09-22
LI, WENHAO
Executed: 2021-09-21
MOREIN, STEPHEN
Executed: 2021-09-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Technologies for High Throughput Additive Manufacturing for Integrated Circuit Components