Patent Assignment
Reel/Frame 058413/0830
Assignment of Assignor's Interest
Recorded: 2021-12-17
Pages: 5
Assignors
TSAI, CHEN-FONG
Executed: 2021-06-17
SHEU, JYH-CHERNG
Executed: 2021-06-17
CHANG, HUICHENG
Executed: 2021-06-17
YEO, YEE-CHIA
Executed: 2021-06-17
CHANG, CHIEH
Executed: 2021-12-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bonding System and Method for Using the Same