Patent Assignment
Reel/Frame 058419/0765
Assignment of Assignor's Interest
Recorded: 2021-12-17
Pages: 6
Assignors
KO, YEONGBEOM
Executed: 2021-11-12
KIM, WOOJU
Executed: 2021-11-12
NAM, HEEJAE
Executed: 2021-11-12
RYU, JUNGSEOK
Executed: 2021-11-12
PARK, HAEMIN
Executed: 2021-11-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Non-Conductive Film and Method for Forming the Same