Patent Assignment
Reel/Frame 058437/0114
Assignment of Assignor's Interest
Recorded: 2021-12-20
Pages: 4
Assignors
HUNTEAK LEE
Executed: 2018-11-06
DEOKKYUNG YANG
Executed: 2018-11-06
HEESOO LEE
Executed: 2018-11-06
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.