Patent Assignment
Reel/Frame 058458/0059
Assignment of Assignor's Interest
Recorded: 2021-12-22
Pages: 6
Assignors
LEE, YUNSEONG
Executed: 2021-12-06
HEO, JINSEONG
Executed: 2021-12-06
MOON, TAEHWAN
Executed: 2021-12-06
NAM, SEUNGGEOL
Executed: 2021-12-06
CHOE, DUKHYUN
Executed: 2021-12-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Layer Structure Including Dielectric Layer, Methods of Manufacturing the Layer Structure, and Electronic Device Including the Layer Structure