Patent Assignment
Reel/Frame 058476/0418
Assignment of Assignor's Interest
Recorded: 2021-12-24
Pages: 6
Assignors
KIM, CHANGHEE
Executed: 2021-12-14
KIM, KYUNGSOO
Executed: 2021-12-14
BAE, DONGIL
Executed: 2021-12-14
WHANG, SUNGMAN
Executed: 2021-12-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Integrated Circuit Device and Manufacturing Method Thereof