Patent Assignment
Reel/Frame 058477/0923
Assignment of Assignor's Interest
Recorded: 2021-12-27
Pages: 4
Assignor
LUO, NUO-WEI
Executed: 2021-12-23
Assignee
UNITED MICROELECTRONICS CORPORATION
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Wafer Processing Method