Patent Assignment
Reel/Frame 058484/0996
Assignment of Assignor's Interest
Recorded: 2021-12-27
Pages: 4
Assignors
LIU, JUN
Executed: 2021-12-21
DAI, HONG GANG
Executed: 2021-12-21
CHENG, DONG XIANG
Executed: 2021-12-21
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
NO.18, WEN CHANG RD., ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100716, CHINA
Covered Property
(1)
Semiconductor Structure and Fabrication Method Thereof