Patent Assignment
Reel/Frame 058488/0213
Assignment of Assignor's Interest
Recorded: 2021-12-28
Pages: 4
Assignors
ISHIKAWA, TAKAHIRO
Executed: 2021-12-14
ICHIGI, TAKENORI
Executed: 2021-12-15
OTAKI, TSUTOMU
Executed: 2021-12-16
Assignees
NGK INSULATORS, LTD.
2-56, SUDA-CHO, MIZUHO-KU, NAGOYA-CITY, AICHI-PREFECTURE, 467-8530, JAPAN
TATSUNO CORPORATION
2-6, MITA 3-CHOME, MINATO-KU, TOKYO, 108-8520, JAPAN
Covered Property
(1)
Beryllium Copper Alloy Bonded Body and Production Method Therefor