Patent Assignment
Reel/Frame 058488/0927
Assignment of Assignor's Interest
Recorded: 2021-12-28
Pages: 2
Assignor
TAKEYA, MOTONOBU
Executed: 2021-12-21
Assignee
ULDTEC CO., LTD.
ROOM 205, ASAHI PLAZA JOZENJIKITA, 11-13, KOKUBUNCHO 3-CHOME, AOBA-KU, SENDAI-SHI, MIYAGI, 9800803, JAPAN
Covered Property
(1)
Semiconductor Chip Integrated Device Manufacturing Method, Semiconductor Chip Integrated Device, Semiconductor Chip Integrated Device Assembly, Semiconductor Chip Ink, and Semiconductor Chip Ink Ejection Device