Patent Assignment
Reel/Frame 058497/0087
Assignment of Assignor's Interest
Recorded: 2021-12-14
Pages: 8
Assignors
ITO, AKIHIRO
Executed: 2021-11-22
YAJIMA, MICHIAKI
Executed: 2021-11-29
KOBUNE, MIKA
Executed: 2021-12-02
IKABATA, TAKAHIRO
Executed: 2021-12-09
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Heat Conduction Sheet, Method of Manufacturing Heat Conduction Sheet, and Heat Dissipating Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →