Patent Assignment
Reel/Frame 058499/0388
Assignment of Assignor's Interest
Recorded: 2021-12-29
Pages: 3
Assignors
ISHINO, HIROSHI
Executed: 2021-09-01
MIWA, RYOTA
Executed: 2021-09-01
OMAE, SHOICHIRO
Executed: 2021-09-29
NAGASE, TAKUO
Executed: 2021-09-04
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Semiconductor Module