Patent Assignment
Reel/Frame 058505/0128
Assignment of Assignor's Interest
Recorded: 2021-12-30
Pages: 6
Assignors
PARK, JUNG HYUN
Executed: 2021-11-12
KIM, KWANG HO
Executed: 2021-11-12
KIM, JOO SEONG
Executed: 2021-11-12
YANG, JUN HYEOK
Executed: 2021-11-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Temperature Sensing Device and System on Chip