Patent Assignment
Reel/Frame 058530/0686
Assignment of Assignor's Interest
Recorded: 2022-01-03
Pages: 2
Assignor
CHIANG, CHIH-YU
Executed: 2021-12-29
Assignee
WINBOND ELECTRONICS CORP.
NO. 8, KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method of Forming the Same