Patent Assignment
Reel/Frame 058532/0167
Assignment of Assignor's Interest
Recorded: 2022-01-04
Pages: 4
Assignors
CHIEN, HENG-CHIEH
Executed: 2021-12-21
YANG, SHU-JUNG
Executed: 2021-12-21
LIN, YU-MIN
Executed: 2021-12-21
WANG, CHIH-YAO
Executed: 2021-12-21
CHAO, YU-LIN
Executed: 2021-12-21
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 310401, TAIWAN
Covered Property
(1)
Heterogeneous Integration Semiconductor Package Structure