Patent Assignment
Reel/Frame 058540/0494
Assignment of Assignor's Interest
Recorded: 2022-01-04
Pages: 9
Assignors
WE, HONG BOK
Executed: 2021-11-29
BUOT, JOAN REY VILLARBA
Executed: 2021-11-29
KIM, MICHELLE YEJIN
Executed: 2021-11-29
KANG, KUIWON
Executed: 2021-12-23
PATIL, ANIKET
Executed: 2021-12-06
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Integrated Circuit (Ic) Packages Employing a Package Substrate with a Double Side Embedded Trace Substrate (Ets), and Related Fabrication Methods