Patent Assignment
Reel/Frame 058555/0653
Assignment of Assignor's Interest
Recorded: 2022-01-05
Pages: 4
Assignors
LIN, CHENG-I
Executed: 2021-11-15
LIN, MING-HO
Executed: 2021-11-15
LEE, DA-YUAN
Executed: 2021-11-18
CHUI, CHI ON
Executed: 2021-11-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device with Dielectric Layer and Method of Forming the Same
Application:
17/568,926 →
Publication:
US 2023/0008994