Patent Assignment
Reel/Frame 058555/0825
Assignment of Assignor's Interest
Recorded: 2022-01-05
Pages: 6
Assignors
SCHIEFERDECKER, JÖRG
Executed: 2021-12-15
HERRMANN, FRANK
Executed: 2021-12-16
SCHMIDT, CHRISTIAN
Executed: 2021-12-16
LENEKE, WILHELM
Executed: 2021-12-16
FORG, BODO
Executed: 2021-12-15
SIMON, MARION
Executed: 2021-12-16
SCHNORR, MICHAEL
Executed: 2021-12-16
Assignee
HEIMANN SENSOR GMBH
MARIA-REICHE-STR. 1, DRESDEN, 01109, GERMANY
Covered Property
(1)
Method for Producing a Thermal Infrared Sensor Array in a Vacuum-Filled Wafer-Level Housing