IP Library › Assignment 058564/0283
Patent Assignment
Reel/Frame 058564/0283

Assignment of Assignor's Interest

Recorded: 2022-01-06 Pages: 3
Assignor
LIN, HSIANG-WEI
Executed: 2021-11-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Conductive Features with Air Spacer and Method of Forming Same
Application: 17/568,984 →
Publication: US 2023/0038952