Patent Assignment
Reel/Frame 058588/0592
Assignment of Assignor's Interest
Recorded: 2022-01-10
Pages: 4
Assignors
WANG, CHUEI-TANG
Executed: 2022-01-04
CHANG, WEI LING
Executed: 2022-01-05
CHEN, CHIEH-YEN
Executed: 2022-01-04
YU, CHEN-HUA
Executed: 2022-01-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method of Forming Same